edwards vacuumNews & Events(1)

CRAWLEY, WEST SUSSEX, UK (20 February 2008)—Edwards, a leading global supplier of vacuum and abatement equipment and services, today introduced the new iXH series of vacuum pumps, the next-generation in its industry-leading family of harsh process vacuum pump products for the semiconductor industry.

Designed to meet the increasing demands of the emerging processes required for semiconductor manufacturing at 60 nm and smaller design rules, the iXH also helps reduce tool cost-of-ownership (CoO), offers a smaller footprint than previous generations and features a modular design that enables a quicker response to emerging process requirements.

“Along with the drive for higher productivity, new semiconductor manufacturing processes, such as atomic layer deposition (ALD), and compound semiconductor processes, such as gallium nitride, are creating new challenges for vacuum pump technology in terms of powder handling, hydrogen flow, fluorine plasma cleans, ammonia flows and precursor reactions,” said Nigel Hunton, Chief Executive Officer, Edwards.

“The iXH has been specifically designed to meet these challenges with enhanced purge flow, temperature-controlled operating range, light gas performance and corrosive gas resistance. Its extended capabilities also offer improved CoO by lengthening pump life and helping to deliver lower utility costs.”Unlike earlier process technologies that deposited up to 90 percent of the precurser on the wafer, ALD processes, such as high K dielectrics, generally deposit less than 10 percent, dramatically increasing the potential for deposition in the pumps.

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